Semiconductor manufacturing apparatus
US6214740A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 16, 1998 |
| Grant date | Apr 10, 2001 |
| Priority date | — |
| Expiry date | Apr 16, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/3065
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A manufacturing apparatus for semiconductor devices comprises as a halogen scavenger a silicon ring (12) having an average surface roughness of 1-1000 .mu.m, arranged around a silicon substrate (6) on a lower electrode (3) in a reaction chamber (7); and an upper silicon element (5) as another halogen scavenger, having an average surface roughness of 1-1000 .mu.m, arranged above the silicon substrate (6). In this apparatus, C.sub.2 F.sub.6 is used as a gas to be introduced into the chamber (7) and fluorine can be effectively scavenged in the initial phase of operation, so that semiconductor devices can be aged faster than in conventional apparatus.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.