Vacuum compatible, deformable electrostatic chuck with high thermal conductivity
US6215642A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Mar 11, 1999 |
| Grant date | Apr 10, 2001 |
| Priority date | — |
| Expiry date | Mar 11, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH02N13/00
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A vacuum compatible, deformable electrostatic chuck with high thermal conductivity including a membrane having a layer of dielectric material, a layer of metallic film and a layer of semiconductor material with struts and a rim formed on the layer of semiconductor material. The rim is formed on the periphery of the layer of semiconductor material. The rim and struts contact a surface of a supporting structure forming a hollow area in which a coolant gas may be circulated. The supporting structure has gas manifold holes to connect the hollow area with a source of coolant gas. In a first embodiment, the struts have a rectangular cross section and are formed as a continuous structure from a first point on the rim to a second point on the rim. In a second embodiment, the struts are flexure struts having a first section with a rectangular cross section and a second section formed as a truncated cone or a pyramid.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.