Method for manufacturing raised electrical contact pattern of controlled geometry
US6215670A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Feb 5, 1999 |
| Grant date | Apr 10, 2001 |
| Priority date | — |
| Expiry date | Feb 5, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49609
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic assembly. The electronic assembly includes a first substrate which has a first set of contact pads and a second substrate which has a second set of contact pads. A plurality of elongate, springable interconnection elements are located between the first substrate and the second substrate. Each of the plurality of elongate, springable interconnect elements is free standing and has a portion permanently attached to a respective contact pad of the first set of contact pads and has a second portion contacting a respective contact pad of the second set of contact pads. The first and the second substrates are brought into a fixed relationship relative to one another.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.