Igor Y. Khandros
200Patents
83h-index
67Co-inventors
93Inventor score
Filing activity: Aug 7, 1981 → Dec 27, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5148265A | Semiconductor chip assemblies with fan-in leads | Electricity | 740 | Expired |
| US5148266A | Semiconductor chip assemblies having interposer and flexible lead | Emerging Cross-Sectional Technologies | 724 | Expired |
| US5772451A | Sockets for electronic components and methods of connecting to electronic components | Emerging Cross-Sectional Technologies | 453 | Expired |
| US5476211A | Method of manufacturing electrical contacts, using a sacrificial member | Emerging Cross-Sectional Technologies | 442 | Expired |
| US5679977A | Semiconductor chip assemblies, methods of making same and components for same | Emerging Cross-Sectional Technologies | 430 | Expired |
| US5974662A | Method of planarizing tips of probe elements of a probe card assembly | Emerging Cross-Sectional Technologies | 396 | Expired |
| US5917707A | Flexible contact structure with an electrically conductive shell | Emerging Cross-Sectional Technologies | 340 | Expired |
| US5994152A | Fabricating interconnects and tips using sacrificial substrates | Electricity | 322 | Expired |
| US6336269B1 | Method of fabricating an interconnection element | Emerging Cross-Sectional Technologies | 312 | Expired |
| US5806181A | Contact carriers (tiles) for populating larger substrates with spring contacts | Emerging Cross-Sectional Technologies | 304 | Expired |
| US6064213A | Wafer-level burn-in and test | Electricity | 278 | Expired |
| US5347159A | Semiconductor chip assemblies with face-up mounting and rear-surface connection to substrate | Electricity | 262 | Expired |
| US5829128A | Method of mounting resilient contact structures to semiconductor devices | Emerging Cross-Sectional Technologies | 254 | Expired |
| US6029344A | Composite interconnection element for microelectronic components, and method of making same | Emerging Cross-Sectional Technologies | 228 | Expired |
| US6184053A | Method of making microelectronic spring contact elements | Electricity | 225 | Expired |
| US5536909A | Semiconductor connection components and methods with releasable lead support | Emerging Cross-Sectional Technologies | 218 | Expired |
| US5998864A | Stacking semiconductor devices, particularly memory chips | Emerging Cross-Sectional Technologies | 215 | Expired |
| US5832601A | Method of making temporary connections between electronic components | Emerging Cross-Sectional Technologies | 209 | Expired |
| US6110823A | Method of modifying the thickness of a plating on a member by creating a temperature gradient on the member, applications for employing such a method, and structures resulting from such a method | Emerging Cross-Sectional Technologies | 199 | Expired |
| US6215670A | Method for manufacturing raised electrical contact pattern of controlled geometry | Emerging Cross-Sectional Technologies | 197 | Expired |
| US6778406B2 | Resilient contact structures for interconnecting electronic devices | Emerging Cross-Sectional Technologies | 194 | Expired |
| US6043563A | Electronic components with terminals and spring contact elements extending from areas which are remote from the terminals | Electricity | 191 | Expired |
| US5864946A | Method of making contact tip structures | Emerging Cross-Sectional Technologies | 184 | Expired |
| US6520778B1 | Microelectronic contact structures, and methods of making same | Electricity | 182 | Expired |
| US6482013B2 | Microelectronic spring contact element and electronic component having a plurality of spring contact elements | Emerging Cross-Sectional Technologies | 182 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.