Chemical-mechanical polisher
US6217419A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 16, 1999 |
| Grant date | Apr 17, 2001 |
| Priority date | — |
| Expiry date | Aug 16, 2019 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B49/16
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A chemical-mechanical polishing apparatus includes a polishing table having a top surface and an annular trench formed in the top surface and defining an annular configured polishing area in the polishing table. A drive mechanism rotates the polishing table. An annular diaphragm is positioned within the annular configured polishing area and has a top surface and bottom surface. An annular configured polishing pad is positioned on the diaphragm. A fluid actuated pressure mechanism is associated with the annular configured polishing area for exerting pressure upward onto the bottom surface of the annular diaphragm as a polishing table rotates for exerting an upward biasing pressure onto the polishing pad and imparting a desired counter force against any downward pressure exerted against a semiconductor wafer during chemical-mechanical polishing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.