Mold-BGA-type semiconductor device and method for making the same
US6218728A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Oct 26, 1998 |
| Grant date | Apr 17, 2001 |
| Priority date | — |
| Expiry date | Oct 26, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1815
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Disclosed is a mold-BGA-type semiconductor device which has: a semiconductor chip which includes insulating resin film formed on at least a part of the surface of the semiconductor chip except a pad; a conductive layer formed in a region on the insulating resin film, the region including at least part corresponding to a position where a solder ball is mounted; a first metal thin wire which is wire-bonded between the pad and the conductive layer; a second metal thin wire which is wire-bonded on the conductive layer; resin part which seals the semiconductor chip, the resin part including a hole to expose part of the second metal thin wire; and a solder ball which is mounted on the hole.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.