High bandwidth passive integrated circuit tester probe card assembly
US6218910A · kind A · utility
161Cited by
8References
22Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Feb 25, 1999 |
| Grant date | Apr 17, 2001 |
| Priority date | — |
| Expiry date | Feb 25, 2019 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R1/06772
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Described herein is a probe card assembly providing signal paths for conveying high frequency signals between bond pads of an integrated circuit (IC) and an IC tester. The frequency response of the probe card assembly is optimized by appropriately distributing, adjusting and impedance matching resistive, capacitive and inductive impedance values along the signal paths so that the interconnect system behaves as an appropriately tuned Butterworth or Chebyshev filter.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.