Cerium oxide abrasive and method of polishing substrates
US6221118A · kind A · utility
62Cited by
6References
1Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 10, 1999 |
| Grant date | Apr 24, 2001 |
| Priority date | — |
| Expiry date | Aug 10, 2019 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC01P2006/12
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
This invention provides a cerium oxide abrasive with which the surfaces of substrates such as SiO.sub.2 insulating films can be polished at a high rate without causing scratches. The abrasive of the present invention comprises a slurry comprising cerium oxide particles whose primary particles have a diameter of from 10 nm to 600 nm and a median diameter of from 30 nm to 250 nm and slurry particles have a median diameter of from 150 nm to 600 nm and a maximum diameter of 3,000 nm or smaller, the cerium oxide particles being dispersed in a medium.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.