Hiroki Terazaki
20Patents
6h-index
13Co-inventors
62Inventor score
Filing activity: Aug 10, 1999 → Mar 2, 2012
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6221118A | Cerium oxide abrasive and method of polishing substrates | Chemistry; Metallurgy | 62 | Expired |
| US6343976B1 | Abrasive, method of polishing wafer, and method of producing semiconductor device | Electricity | 26 | Expired |
| US6863700B2 | Cerium oxide abrasive and method of polishing substrates | Chemistry; Metallurgy | 18 | Expired |
| US6899821B2 | Abrasive liquid for metal and method for polishing | Electricity | 14 | Expired |
| US6896825B1 | Abrasive liquid for metal and method for polishing | Electricity | 13 | Expired |
| US7250369B1 | Materials for polishing liquid for metal, polishing liquid for metal, method for preparation thereof and polishing method using the same | Electricity | 8 | Expired |
| US7799688B2 | Polishing fluid and method of polishing | Electricity | 6 | Active |
| US7115021B2 | Abrasive, method of polishing target member and process for producing semiconductor device | Electricity | 5 | Expired |
| US7708788B2 | Cerium oxide abrasive and method of polishing substrates | Chemistry; Metallurgy | 4 | Expired |
| US8491807B2 | Abrasive liquid for metal and method for polishing | Electricity | 3 | Active |
| US8226849B2 | Materials for polishing liquid for metal, polishing liquid for metal, method for preparation thereof and polishing method using the same | Electricity | 1 | Expired |
| US7963825B2 | Abrasive, method of polishing target member and process for producing semiconductor device | Electricity | 1 | Active |
| US8038898B2 | Abrasive liquid for metal and method for polishing | Electricity | 1 | Expired |
| US8616936B2 | Abrasive, method of polishing target member and process for producing semiconductor device | Electricity | 1 | Active |
| US7871308B2 | Abrasive, method of polishing target member and process for producing semiconductor device | Electricity | 1 | Active |
| US8137159B2 | Abrasive, method of polishing target member and process for producing semiconductor device | Electricity | 1 | Active |
| US8162725B2 | Abrasive, method of polishing target member and process for producing semiconductor device | Electricity | 1 | Active |
| US7799686B2 | Materials for polishing liquid for metal, polishing liquid for metal, method for preparation thereof and polishing method using the same | Electricity | 0 | Active |
| US8900477B2 | Materials for polishing liquid for metal, polishing liquid for metal, method for preparation thereof and polishing method using the same | Electricity | 0 | Active |
| US7867303B2 | Cerium oxide abrasive and method of polishing substrates | Chemistry; Metallurgy | 0 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.