Method of mending erosion of bonding pad
US6221752A · kind A · utility
14Cited by
9References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 5, 1998 |
| Grant date | Apr 24, 2001 |
| Priority date | — |
| Expiry date | Nov 5, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method mending the erosion of bonding pad. A passivation layer and a polyimide layer are sequentially formed on a wafer to cover a bonding pad, where the polyimide layer is patterned to expose a portion of the passivation layer. The polyimide layer is used as a mask for etching the passivation layer, so as to expose the bonding pad. The bonding pad is eroded by the etchant residue remaining after etching the passivation layer on the bonding pad. After removing the eroded part of the bonding pad, an oxide layer is formed subsequently to prevent a further erosion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.