Method for surface treatment of substrates
US6221774A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Apr 5, 1999 |
| Grant date | Apr 24, 2001 |
| Priority date | — |
| Expiry date | Apr 5, 2019 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/105
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A polishing pad (24) is rotated about an axis parallel to a surface (10) of a semiconductor wafer (12). The polishing pad (24) is supported by a roller (22) that receives fluid (38) and distributes the fluid through the polishing pad (24) across the surface of the wafer. The surface (10) of the wafer is moved in relation to the polishing pad so that the wafer surface is smoothed, or touch-polished, with or without the use of abrasive slurry. In one embodiment the wafer is rotated between an upper roller assembly (20) and a lower roller assembly (14). In another embodiment, the polishing pad is held at an angle to the surface of the wafer to remove a ridge of material from a donor wafer for re-use in a thin film transfer process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.