Memory package method and apparatus
US6222211A · kind A · utility
8Cited by
5References
27Claims
0Family size
Inventor
Key dates
| Filing date | Nov 19, 1999 |
| Grant date | Apr 24, 2001 |
| Priority date | — |
| Expiry date | Nov 19, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10B99/22
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A method and apparatus configures the data bits of partially defective memory devices in order to construct usable memory chip or module packages that meet the specification of a fully or partially functional package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.