Patent · US Expired

Flip-chip having an on-chip decoupling capacitor

US6222246A · kind A · utility

55Cited by
17References
17Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJan 8, 1999
Grant dateApr 24, 2001
Priority date—
Expiry dateJan 8, 2019

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY02P70/50
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

A flip-chip having a decoupling capacitor electrically coupled to the backside thereof. The flip-chip includes a semiconductor substrate having first and second opposing surfaces with circuit elements formed within the first surface. A plurality of raised bump contacts are located on the first surface and connected to the circuit elements. A plurality of electrical interconnects are also located on or within the second surface and connected to the circuit elements. The electrodes of a decoupling capacitor are electrically coupled to the plurality of electrical interconnects.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.