Low-cost high-density gang punch
US6223636A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 3, 1998 |
| Grant date | May 1, 2001 |
| Priority date | — |
| Expiry date | Aug 3, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T83/943
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A gang-punch pin apparatus for punching selected hole patterns in thin sheet materials such as greensheets is provided. The gang-punch pin apparatus uses program plates in the punch apparatus which plates are positioned intermediate the non-punching end of the punch pins and a clearance plate wherein punch pins not used for punching a particular layer of the MLC are retracted into during punching. At the other punch pin locations, the punch pins, upon activation of the punch apparatus by compressing an expandable chamber, usually by application of a force on the punch apparatus, are extended through the lower portion of the punch apparatus to form vias in a greensheet. A die apparatus is also provided for use with the punch assembly to form the vias and to remove the punched material (slugs) from the die apparatus. The gang punch-pin may be shorter than conventional pins and be made at a low cost because of the thin sheet metal plates preferably used to make the component parts of the punch and die apparatus.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.