Lead frame, method of manufacturing lead frame, semiconductor device and method of manufacturing semiconductor device
US6225146A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 27, 1999 |
| Grant date | May 1, 2001 |
| Priority date | — |
| Expiry date | Jul 27, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In a lead frame, inside inner leads are supported by supporting leads through an insulator. The inside inner leads and outside inner leads are separated from one another and are doubly arranged. In manufacturing a semiconductor device by using this lead frame, a semiconductor chip is mounted on the insulator, and the semiconductor chip is connected with the inside inner leads and the outside inner leads through metal wires, and the resultant is sealed with a resin. Thus, projections provided on the bottoms of the inside inner leads and the outside inner leads can work as external terminals. Since the external terminals can be disposed two-dimensionally on the bottom the lead frame is applicable to high density packaging and multi-pin devices, and can additionally provide a so-called burr-less structure free from uncut waste of the resin.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.