Process for producing chip and pressure sensitive adhesive sheet for said process
US6225194A · kind A · utility
21Cited by
10References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 15, 1999 |
| Grant date | May 1, 2001 |
| Priority date | — |
| Expiry date | Jul 15, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2861
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A process for producing a chip, comprising the steps of: PA1 attaching an object to be diced on a pressure sensitive adhesive sheet comprising at least one layer of shrinkable film and a pressure sensitive adhesive layer; PA1 dicing the object into chips, and PA1 shrinking the shrinkable film to thereby reduce an area in which the chips are in contact with the pressure sensitive adhesive. In this process, chips of small thickness and large area can easily be picked up without the need to use a thrust needle in the chip pickup step.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.