Method and apparatus for securing components of wafer processing fixtures
US6225594A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Apr 15, 1999 |
| Grant date | May 1, 2001 |
| Priority date | — |
| Expiry date | Apr 15, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67303
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A silicon wafer processing fixture is made by providing a first silicon member with an outwardly extending attachment element. A second silicon member is provided with an attachment element receiving portion receives the extending attachment element of the first member which are then fixedly secured. The step of fixedly securing the members together can be accomplished by providing a first transverse bore in the attachment element and a second transverse bore in the attachment element receiving portion. The two bores are aligned, and a locating pin is used to secure the elements together. Alternatively, laser energy can be applied or adhesive to fixedly secure the elements together.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.