Integrated circuit package
US6226187A · kind A · utility
9Cited by
7References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 5, 1999 |
| Grant date | May 1, 2001 |
| Priority date | — |
| Expiry date | Aug 5, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49146
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The bond strength between a semiconductor chip and a metal heat sink in an integrated circuit package can be improved by using an adhesive system comprising two separate layers, one layer exhibiting preferential bonding strength for the chip and the other layer exhibiting preferential bonding strength for the metal heat sink.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.