Patent · US Expired

Method of constructing a wafer carrier

US6227590A · kind A · utility

3Cited by
15References
21Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJun 12, 2000
Grant dateMay 8, 2001
Priority date
Expiry dateJun 12, 2020

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L21/67316
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

A wafer carrier for use in the transportation and storage of semiconductor wafers. More particularly, the invention is a wafer carrier having both a rigid structure and a corrosion resistant coating. The wafer carrier includes a unitary frame having several wafer supports joined by connecting members. The frame is coated with a material, such as a fluoropolymer, which is resistant to corrosive materials typically used in semiconductor fabrication processes.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.