Pad quick release device for chemical mechanical polishing
US6227956A · kind A · utility
18Cited by
4References
21Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Nov 2, 1999 |
| Grant date | May 8, 2001 |
| Priority date | — |
| Expiry date | Nov 2, 2019 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24D9/08
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A chemical-mechanical polishing apparatus (100, 200) comprising a polishing pad assembly. The polishing pad assembly (300) comprises a removable cap (318) to be rotatably coupled to a drive device of a chemical mechanical polishing apparatus and a polishing pad comprising a fixed abrasive disposed on the removable cap. The removable cap (318) and the polishing pad being a detached unit to be attached to or removed from the drive device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.