Method of manufacturing a sensor
US6228275A · kind A · utility
9Cited by
9References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 10, 1998 |
| Grant date | May 8, 2001 |
| Priority date | — |
| Expiry date | Dec 10, 2018 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01P2015/0814
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A sensor has a support substrate (200), an electrode (110, 510, 710) movable relative to a surface (201) of the support substrate (200) and comprised of a first material, a structure (160, 460, 560, 760) over a portion of the electrode (110, 510, 710) to limit mobility of the electrode (110, 510, 710) and comprised of a second material different from the first material, and bonding pads (170, 470) outside a perimeter of the electrode (110, 510, 710) and comprised of the second material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.