Endpoint detection by chemical reaction and reagent
US6228280A · kind A · utility
35Cited by
19References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 6, 1998 |
| Grant date | May 8, 2001 |
| Priority date | — |
| Expiry date | May 6, 2018 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B49/00
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method for detecting the endpoint for removal of a target film overlying a stopping film by chemical-mechanical polishing using a slurry, by removing the target film with a polishing process that generates a chemical reaction product (for example ammonia when polishing a wafer with a nitride film in a slurry containing KOH) in the slurry, adding to the slurry a reagent which produces a characteristic result upon reacting with the chemical reaction product, and monitoring the slurry for the characteristic result as the target film is removed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.