Nonwoven reinforcement for printed wiring base board and process for producing the same
US6229096A · kind A · utility
Assignees
Inventors
Key dates
| Filing date | Oct 6, 1998 |
| Grant date | May 8, 2001 |
| Priority date | — |
| Expiry date | Oct 6, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T442/2475
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
There are disclosed a nonwoven reinforcement for a printed wiring base board which nonwoven reinforcement contains a wet system nonwoven fabric constituted of thermotropic cystalline polyester fiber having a melting point of 290.degree. C. or higher (component A) and a thermotropic cystalline polyester binder which has a melting point of 290.degree. C. or higher and is in the form of a film having holes including at least 5 holes/mm.sup.2 each with an area of opening of 400 to 1000 .mu.m.sup.2 (component B), the component A being fixed by the component B; a process for producing the above nonwoven reinforcement; a printed wiring base board produced from the above nonwoven reinforcement; and a printed wiring board produced from the above printed wiring base board. The nonwoven reinforcement and the printed wiring (base) board are excellent in various performances such as uniformity, dimensional stability, heat resistance and electrical characteristics such as dielectric constasnt and dielectric loss tangent.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.