Low thermal strain flexure support for a micromechanical device
US6230567A · kind A · utility
40Cited by
5References
8Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 3, 1999 |
| Grant date | May 15, 2001 |
| Priority date | — |
| Expiry date | Aug 3, 2019 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01P2015/0831
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A low thermal strain flexure support for a micromechanical device includes a substrate; a micromechanical device having a rotational axis and a longitudinal axis; an anchor structure disposed on the substrate proximate the longitudinal axis of the micromechanical device; first and second support members extending outwardly oppositely from the anchor structure; and first and second flexures extending inwardly in the direction of the axis of rotation of the micromechanical device from the first and second support members, respectively, to the micromechanical device for suspending the micromechanical device from the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.