Process for stripping the surface of a substrate and apparatus for implementing this process
US6231727A · kind A · utility
4Cited by
5References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 2, 1998 |
| Grant date | May 15, 2001 |
| Priority date | — |
| Expiry date | Oct 2, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/3444
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Process for continuously stripping the surface of a substrate moving in a defined direction through a vacuum chamber past at least one counterelectrode, according to which process a plasma is created in a gas, between this counterelectrode and this surface, so as to generate radicals and/or ions which can act on the surface to be stripped, characterized in that at least one pair of successive counterelectrodes, past which the abovementioned chamber and in that an alternating potential is applied to these counterelectrodes so as to impose on the latter an alternately positive and negative potential with respect to the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.