Method and apparatus for metal oxide chemical vapor deposition on a substrate surface
US6231933A · kind A · utility
4Cited by
11References
29Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 18, 1999 |
| Grant date | May 15, 2001 |
| Priority date | — |
| Expiry date | Mar 18, 2019 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C16/4415
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method and apparatus for improved metal oxide chemical vapor deposition on a substrate surface where the application boundary layer is reduced and where the uniformity of the application boundary layer is greatly enhanced in a reactor. Primary and secondary sonic or other disturbance sources are incorporated for introducing disturbance into the interior chamber of the reactor, or an oscillating or vibrating chuck is incorporated within the interior chamber, to influence the boundary layer thickness and uniformity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.