Dehumidified cooling assembly for IC chip modules
US6233959A · kind A · utility
53Cited by
16References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 12, 1999 |
| Grant date | May 22, 2001 |
| Priority date | — |
| Expiry date | Oct 12, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/16
- WIPO fieldOther consumer goods
- WIPO sectorOther fields
Abstract
A cooling assembly for an integrated circuit chip module wherein an evaporator-cooled IC module is enclosed within an insulated housing which is surrounded by an atmosphere of dehumidified air.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.