Apparatus and method for conditioning a polishing pad
US6234868A · kind A · utility
21Cited by
7References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 30, 1999 |
| Grant date | May 22, 2001 |
| Priority date | — |
| Expiry date | Apr 30, 2019 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B49/16
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An apparatus and method for conditioning a polishing pad used in a chemical mechanical polishing (CMP) process. The polishing pad is conditioned by the application of a conditioning device to the surface of the rotating polishing pad. The amount of force which is applied to the conditioning device is directly controlled by a force control mechanism so as to make the conditioning process more consistent.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.