Serial intelligent electro-chemical-mechanical wafer processor
US6234870A · kind A · utility
85Cited by
19References
37Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 24, 1999 |
| Grant date | May 22, 2001 |
| Priority date | — |
| Expiry date | Aug 24, 2019 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B49/04
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An apparatus for removing material from a substrate including a plurality of polishing cells. A first polishing cell detects the material on the substrate and performs a first polishing operation for removing material from the substrate. The first polishing cell includes at least one sensor for characterizing the material on the substrate and at least one polishing tool for removing material from the substrate. A second polishing cell includes at least one polishing tool for completing the polishing process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.