Daniel C. Edelstein
312Patents
39h-index
278Co-inventors
93Inventor score
Filing activity: Apr 11, 1990 → Sep 23, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7084079B2 | Method for low temperature chemical vapor deposition of low-k films using selected cyclosiloxane and ozone gases for semiconductor applications | Electricity | 577 | Expired |
| US6531412B2 | Method for low temperature chemical vapor deposition of low-k films using selected cyclosiloxane and ozone gases for semiconductor applications | Electricity | 518 | Expired |
| US6153935A | Dual etch stop/diffusion barrier for damascene interconnects | Electricity | 315 | Expired |
| US6323128A | Method for forming Co-W-P-Au films | Electricity | 259 | Expired |
| US9496239B1 | Nitride-enriched oxide-to-oxide 3D wafer bonding | Electricity | 218 | Active |
| US9620481B2 | Substrate bonding with diffusion barrier structures | Electricity | 197 | Active |
| US9941241B2 | Method for wafer-wafer bonding | Electricity | 196 | Active |
| US6181012A | Copper interconnection structure incorporating a metal seed layer | Electricity | 185 | Expired |
| US5793272A | Integrated circuit toroidal inductor | Emerging Cross-Sectional Technologies | 181 | Expired |
| US5884990A | Integrated circuit inductor | Emerging Cross-Sectional Technologies | 174 | Expired |
| US9064874B2 | Interconnect with titanium—oxide diffusion barrier | Electricity | 168 | Active |
| US6114937A | Integrated circuit spiral inductor | Emerging Cross-Sectional Technologies | 149 | Expired |
| US5559367A | Diamond-like carbon for use in VLSI and ULSI interconnect systems | Electricity | 132 | Expired |
| US6103096A | Apparatus and method for the electrochemical etching of a wafer | Electricity | 120 | Expired |
| US7276787B2 | Silicon chip carrier with conductive through-vias and method for fabricating same | Electricity | 90 | Expired |
| US6234870A | Serial intelligent electro-chemical-mechanical wafer processor | Performing Operations; Transporting | 85 | Expired |
| US6153043A | Elimination of photo-induced electrochemical dissolution in chemical mechanical polishing | Electricity | 82 | Expired |
| US6335104B1 | Method for preparing a conductive pad for electrical connection and conductive pad formed | Emerging Cross-Sectional Technologies | 81 | Expired |
| US9324650B2 | Interconnect structures with fully aligned vias | Electricity | 76 | Active |
| US6358832B1 | Method of forming barrier layers for damascene interconnects | Electricity | 68 | Expired |
| US8525169B1 | Reliable physical unclonable function for device authentication | Electricity | 66 | Active |
| US6649531B2 | Process for forming a damascene structure | Electricity | 60 | Expired |
| US7033927B2 | Apparatus and method for thermal isolation, circuit cooling and electromagnetic shielding of a wafer | Electricity | 60 | Expired |
| US6054329A | Method of forming an integrated circuit spiral inductor with ferromagnetic liner | Emerging Cross-Sectional Technologies | 55 | Expired |
| US5679269A | Diamond-like carbon for use in VLSI and ULSI interconnect systems | Electricity | 55 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.