Method and apparatus for wafer chamfer polishing
US6234879A · kind A · utility
59Cited by
7References
1Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 20, 1996 |
| Grant date | May 22, 2001 |
| Priority date | — |
| Expiry date | Mar 20, 2016 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B41/005
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method and apparatus for polishing chamfers made along the periphery of a semiconductor wafer designed such that when the wafer is once picked up by a rotatory suction cup of a transportation robot arm, the wafer is not released from the suction cup until the entire polishing operation is completed; in an embodiment, a circular turn table having six wafer suction cups is employed which is adapted to turn step-wise, each step consisting of a turn through an angle of 60.degree. to transfer the wafers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.