Non-plasma CVD method and apparatus of forming Ti1-xA1xN coatings
US6238739A · kind A · utility
16Cited by
4References
5Claims
0Family size
Assignee
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Key dates
| Filing date | Feb 2, 1999 |
| Grant date | May 29, 2001 |
| Priority date | — |
| Expiry date | Feb 2, 2019 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C16/34
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method for forming a Ti.sub.1-x Al.sub.x N coating on a part without plasma enhancement, wherein a chemical vapor deposition chamber is heated to 250-500.degree. C.; the part to be coated is heated to 550-650.degree. C. and placed in said chamber; and a mixture of titanium and aluminium chlorides, NH.sub.3 and H.sub.2 is injected into the chamber. The molar amount of NH.sub.3 is greater than the molar amount of chlorides, and the molar amount of hydrogen is over five times greater than the molar amount of chlorides.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.