Coated fine metallic wire and method for fabricating semiconductor device using same
US6239376A · kind A · utility
7Cited by
4References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 16, 1998 |
| Grant date | May 29, 2001 |
| Priority date | — |
| Expiry date | Oct 16, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49192
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A coated fine metallic wire intended for use as a bonding wire in a semiconductor device, includes a fine metallic wire and an insulative layer which contains a pigment or dye which causes the insulative layer to absorb laser light at a high efficiency. The insulative layer is readily removable with a laser light, with no carbonized matter remaining on the fine wire and without damaging the fine wire.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.