Method for removing particles from a surface of an article
US6240931A · kind A · utility
4Cited by
16References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 4, 1997 |
| Grant date | Jun 5, 2001 |
| Priority date | — |
| Expiry date | Nov 4, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S134/902
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for removing particles from a surface of an article, such as a semiconductor wafer in a clean room. The particles are supplied with an electric charge. Subsequently, an ultrasonic wave or a gas stream is applied onto the surface of the article while an electric field is applied for driving away the electrically charged particles from the surface, thereby removing particles having a dimension smaller than 1 micrometer from the surface. The presence of a collecting member allows the removal of resulting, floating particles.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.