Wafer inspecting apparatus and method
US6241456A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 11, 2000 |
| Grant date | Jun 5, 2001 |
| Priority date | — |
| Expiry date | May 11, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S414/141
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
This invention provides a wafer inspecting apparatus which enables macroscopic inspection of the entire surface of a wafer. According to the wafer inspecting apparatus of this invention, the edge portion of a wafer 8 is held by suction with the distal ends of wafer holding portions 702 of a wafer holding arm 7, and first-time observation of the lower surface of the wafer 8 is performed. Then, the wafer 8 is transported onto a center table 6. The center table 6 is rotated through a predetermined angle. The edge portion of the wafer 8 is held by suction again with the distal ends of the wafer holding portions 702 of the wafer holding arm 7. Then, second-time observation of the lower surface of the wafer 8 is performed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.