Compliant wafer chuck
US6241825A · kind A · utility
64Cited by
17References
16Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Apr 16, 1999 |
| Grant date | Jun 5, 2001 |
| Priority date | — |
| Expiry date | Apr 16, 2019 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C16/4583
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A compliant wafer chuck for supporting a substrate in which an upper body of the chuck is allowed to tilt relative to the base.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.