CuTek Research, Inc.
11Patents
0Active
11Granted
31Portfolio score
Filing activity: Aug 22, 1997 → Nov 14, 2000
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6017820A | Integrated vacuum and plating cluster system | Electricity | 142 | Expired |
| US6077412A | Rotating anode for a wafer processing chamber | Chemistry; Metallurgy | 115 | Expired |
| US6017437A | Process chamber and method for depositing and/or removing material on a substrate | Chemistry; Metallurgy | 85 | Expired |
| US6241825A | Compliant wafer chuck | Chemistry; Metallurgy | 64 | Expired |
| US6187152A | Multiple station processing chamber and method for depositing and/or removing material on a substrate | Electricity | 37 | Expired |
| US6179982A | Introducing and reclaiming liquid in a wafer processing chamber | Chemistry; Metallurgy | 29 | Expired |
| US5997712A | Copper replenishment technique for precision copper plating system | Chemistry; Metallurgy | 16 | Expired |
| US6022465A | Apparatus and method utilizing an electrode adapter for customized contact placement on a wafer | Chemistry; Metallurgy | 11 | Expired |
| US6365025B1 | Method for depositing and/or removing material on a substrate | Electricity | 11 | Expired |
| US6454864B2 | Two-piece chuck | Emerging Cross-Sectional Technologies | 4 | Expired |
| US6183611A | Method and apparatus for the disposal of processing fluid used to deposit and/or remove material on a substrate | Chemistry; Metallurgy | 1 | Expired |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.