Saw-singulated leadless plastic chip carrier
US6242281A · kind A · utility
338Cited by
26References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 28, 1999 |
| Grant date | Jun 5, 2001 |
| Priority date | — |
| Expiry date | Jul 28, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19042
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Leadless plastic chip carriers are formed from a matrix of lead frames provided in a section of a metal strip. Each lead frame in the matrix includes a die-attach pad and multiple leads disposed in close proximity to the die-attach pad. After a semiconductor die is attached to each of the die-attach pad and wire-bonded, the leadless plastic chip carriers are formed by providing a plastic encapsulation which exposes the bottom sides of the die-attach pad and the leads. The bottom sides of the leads serve as solder pads to be used for attaching the leadless plastic chip carrier to a printed circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.