Moisture enhanced ball grid array package
US6242802A · kind A · utility
56Cited by
3References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 17, 1995 |
| Grant date | Jun 5, 2001 |
| Priority date | — |
| Expiry date | Jul 17, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit package (10) comprises a semiconductor die (14), and a substrate (16) for receiving the semiconductor die. The substrate has an aperture(s) (18) below the semiconductor die for providing moisture relief during temperature excursions. The semiconductor die is wirebonded to the substrate. An encapsulant (12) seals the top surface of the semiconductor die and serves to bond the semiconductor die to the substrate. The encapsulant also covers portions of the top side of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.