SRAM heat sink assembly and method of assembling
US6243264A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 30, 1999 |
| Grant date | Jun 5, 2001 |
| Priority date | — |
| Expiry date | Aug 30, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat sink assembly includes a heat sink, a circuit board and an integrated circuit package. The package is located between the heat sink and the circuit board and attached to a die attach area of the circuit board. A heat sink retainer attached to the heat sink has a base section located adjacent to the circuit board directly opposite the die attach area. The retainer presses the heat sink down uniformly on the package. Further, the downward force applied to the heat sink is countered by an equal upward force applied by the base section of the retainer on the circuit board. Since the base section is located directly opposite the die attach area, the upward force is transferred from the base section directly back to the heat sink without imparting any bending force on the circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.