Cooled IC chip modules with an insulated circuit board
US6243268A · kind A · utility
34Cited by
11References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 12, 1999 |
| Grant date | Jun 5, 2001 |
| Priority date | — |
| Expiry date | Oct 12, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A cooling assembly for an integrated circuit chip module wherein an evaporator-cooled IC module mounted on a printed circuit board is enclosed within an insulated housing, and the area of the printed circuit board adjacent the cooled IC module is encapsulated in an insulated jacket.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.