Method of forming an interlayer connection structure
US6243946A · kind A · utility
12Cited by
22References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 11, 1997 |
| Grant date | Jun 12, 2001 |
| Priority date | — |
| Expiry date | Apr 11, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49156
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An interlayer connection structure in a circuit board characterized in that a local part of a conductive circuit layer disposed at one surface side of an insulative sheet is bent inwardly of the insulative sheet so that an apex of a projectingly bent portion is formed, and the apex of the projectingly bent portion is abutted with another conductive circuit layer disposed at the other surface side of the insulative sheet so that an interlayer connection is established therebetween.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.