Polishing system including a hydrostatic fluid bearing support
US6244945A · kind A · utility
2Cited by
6References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 1, 2000 |
| Grant date | Jun 12, 2001 |
| Priority date | — |
| Expiry date | Jun 1, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/302
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A polishing system such as a chemical mechanical belt polisher includes a hydrostatic fluid bearing that supports polishing pads and incorporates one or more of the following novel aspects. One aspect uses compliant surfaces surrounding fluid inlets in an array of inlets to extend areas of elevated support pressure around the inlets. Another aspect of the invention provides a hydrostatic bearing with spiral or partial cardiod drain grooves. This bearing has a non-uniform support pressure profile but provides a uniform average pressure to a wafer that is rotated relative to the center of the bearing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.