Lasable bond-ply materials for high density printed wiring boards
US6245696A · kind A · utility
27Cited by
33References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 25, 1999 |
| Grant date | Jun 12, 2001 |
| Priority date | — |
| Expiry date | Jun 25, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T442/697
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
This invention concerns lasable bond-ply materials comprising a nonwoven reinforcing material and at least one resin material. The present invention also includes methods for using the bond-ply of this invention to manufacture high density multilayer printed wiring boards.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.