Laura Miller
3Patents
3h-index
10Co-inventors
40Inventor score
Filing activity: Jun 25, 1999 → Apr 12, 2002
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6245696A | Lasable bond-ply materials for high density printed wiring boards | Emerging Cross-Sectional Technologies | 27 | Expired |
| US6673190B2 | Lasable bond-ply materials for high density printed wiring boards | Emerging Cross-Sectional Technologies | 13 | Expired |
| US6936537B2 | Methods for forming low-k dielectric films | Electricity | 5 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.