High density electronic package
US6246010A · kind A · utility
38Cited by
11References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 25, 1998 |
| Grant date | Jun 12, 2001 |
| Priority date | — |
| Expiry date | Nov 25, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/351
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention is an ultra-thin circuit package with a thinned electronic device having a thickness of less than about 100 .mu.m; a flexible circuit substrate; and an adhesive layer with a thickness of less than about 25 .mu.m between the electronic device and the circuit substrate. The circuit package is less than about 275 .mu.m thick. In another embodiment, the circuit packages may be stacked on one another and laminated together to create an extremely high-density three-dimensional electronic circuit package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.