Heated PCB interconnect for cooled IC chip modules
US6246581A · kind A · utility
23Cited by
18References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 12, 1999 |
| Grant date | Jun 12, 2001 |
| Priority date | — |
| Expiry date | Oct 12, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/165
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A cooling assembly for an integrated circuit chip module wherein an evaporator-cooled IC module is enclosed within an insulated housing and attached to a printed circuit board through an interconnect including a heating element embedded therein.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.