Obtaining the better defect performance of the fuse CMP process by adding slurry polish on more soft pad after slurry polish
US6248002A · kind A · utility
6Cited by
8References
33Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 20, 1999 |
| Grant date | Jun 19, 2001 |
| Priority date | — |
| Expiry date | Oct 20, 2019 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/042
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method to prevent the accumulation of particle impurities on the surface of a semiconductor substrate that contains wolfram plugs during the process of polishing the surface of the wafer. The polishing sequence consists of three distinct polishing steps whereby the first two steps use hard polishing pads while the third step uses a soft polishing pad with the application of slurry during the third polish.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.