Method of growing high-quality crystalline silicon quantum wells for RTD structures
US6248621A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 20, 1999 |
| Grant date | Jun 19, 2001 |
| Priority date | — |
| Expiry date | Oct 20, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/979
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of forming a crystalline silicon well over a perovskite barrier layer, preferably for use in formation of a resonant tunneling diode. A silicon substrate (1) is provided of predetermined crystallographic orientation. A layer of crystallographic perovskite material (5) is formed over the silicon substrate and substantially matched to the lattice constant of the silicon substrate. A layer of crystallographic silicon (7) is formed over the perovskite layer substantially matched to the lattice constant of the perovskite layer. The perovskite layer is formed by the steps of placing the silicon substrate in a chamber and then evaporating a layer of barium strontium oxide (3) thereon with a thickness of from about three to about six Angstroms and then evaporating a layer of calcium strontium titanate (5) thereon having a thickness of from about six to about 25 Angstroms thereon in the case of a tunneling diode. A second layer of silicon oxide (9) is provided on the layer of silicon remote from the perovskite layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.