Dielectric decal for a substrate of an integrated circuit package
US6248951A · kind A · utility
11Cited by
3References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 5, 1999 |
| Grant date | Jun 19, 2001 |
| Priority date | — |
| Expiry date | Jan 5, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit package which may include a decal that is attached to a substrate which supports an integrated circuit. The decal may have a coefficient of thermal expansion that is different than a coefficient of thermal expansion of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.